The Diagnostic Technique for Printed Circuit Boards of Communications Equipment by the Method of Thermal and Electrical Analysis

Abstract

In the modern world, communications systems play a key role in ensuring effective communication and information security. The reliability and serviceability of printed circuit boards of communication equipment directly affect the stability of the entire system. In this regard, the development of effective diagnostic methods is of particular importance, allowing timely detection of malfunctions and preventing their development. The need to ensure reliable and safe operation of complex communication systems and complexes is only increasing every year. The development and improvement of methods of analysis printed circuit boards is actual scientific and technical task, the solution of which will invrease the reliability, productivity and competitiveness of electronic devices. This article develops and describes methods of electrical and thermal analysis. A computer model of a receiver-exciter board with dual frequency conversion has been developed, taking into account thermal and electrical parameters. The possibility and necessity of using computer simulation at the post-opological level is substantiated. Thermal and electrical analysis for direct current was performed using a computer model. The simulation of the board's power supply integrity was performed in the Altium Designer CAD using the extensions PDN Analyzer from CST and Power Analyzer from Keysight. The maps of current density distribution, voltage drops and return paths were constructed. The problem areas requiring topology correction have been found. The Altair Pollex CAD system was used to simulate thermal conditions. which allows conducting research on stationary and non-stationary processes. It can be used to conduct research on stationary and non-stationary processes. A practical comparison of the prototype of the exciter board and the computer model was carried out. It was shown that the obtained the programs of the thermal analysis of the board model, made taking into account the full metallization and structure of the layers, can lead to an error in determining the temperature of electronic components of up to 5%. This makes it possible to make the right decision to ensure the reliability of the product.